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ITCM is a global manufacturer and leading innovator in customised machinery and systems for pharmaceutical packaging and processing.
eFood 2009-10-01 Issue

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eLab 2009-5-15 Issue

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eFood - Packaging

Henkel Easy-Pac

Henkel Easy-Pac

Henkel launches EASY-PAC to the global packaging market. EASY-PAC is a completely new package sealing solution that will save you time and money.

In today's business and manufacturing environment, the over-riding task is to achieve more with less resource. The challenge of running your production lines more efficiently and at a lower cost is a tough one to achieve. The answer is EASY-PAC, the complete package sealing solution that will improve your packaging productivity, while reducing downtime, maintenance and overall cost in use.

EASY-PAC is the all-in-one, hassle-free solution that maximises uptime for packaging professionals who demand world-class efficiencies. EASY-PAC is a turnkey adhesive dispensing package that includes everything you need to revolutionise the way you currently seal cases and cartons:

* A char-fee 90/100°C hot melt adhesive
* Hot melt application unit with a three-year warranty - the longest in the industry!
* Integrated hot melt vacuum feed system
* Hot melt storage bin
* New nozzles, hoses, filters and modules
* Three year replacement parts guarantee program

EASY-PAC has been designed to eliminate the causes of downtime that slow down production and delay your delivery schedules. The biggest cause of this downtime is adhesive char. With the new EASY-PAC package sealing solution, char is eliminated. The EASY-PAC hot melt provides full case and carton sealing functionality at the lowest application temperature on the market; 90°C. At this low temperature, char does not form. The integrated Autofill vacuum feeder eliminates the need to open the hot melt tank, so char-producing contaminants cannot enter the system.

You do not have to stop your line to replace nozzles and hoses, so you save on parts, labour and downtime because EASY-PAC does not produce char.

 

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